sample circuitPrecision Circuit Solutions LLChybrid 4

CUSTOM THICK FILM HYBRID DESIGN AND MANUFACTURINGhybrid 4

DESIGN AND MANUFACTURE OF THICK FILM HYBRID MICROELECTRONICS & COMPONETS AND MICROWAVE DEVICES / COMPONETS

 

    AS9100 REV. C WITH DESIGN -  ISO9001:2008 REGISTERED AND CERTIFIED  -  NSF CERTIFICATE #C0209458-AS1

 

 

"Blending Our Talents With Yours"

 

Custom Thick and Thin Film Hybrid Circuits

Space • Military • Industrial

Analog • Digital • Power • Microwave • Opto-Electronics

 

PERFORMANCE

Optimum conversion of an electronic design into a hybrid device utilizing the best available components, materials and processes. PCS assures you the smallest package consistent with the performance you demand.

TOTAL HYBRID CAPABILITY

Total electrical and mechanical design • Design to cost • Circuit simulation and verification • Thermal analysis • Design reviews at major milestones • Broad range of packages, device types and connection techniques screen • Dynamic laser trimming • Automatic test equipment • Custom packaging and special processing techniques as required.

ADVANCED CONCEPTS

PCS balances the equation with our customers. You give us your requirements and we provide a solution that will give you a competitive advantage.  In all our product lines, PCS sets the state of the art in performance, size, and cost.  Our realized R & D efforts are a tangible asset we provide to you, our customer, to realize performance goals for next generation systems. Advanced packaging, processes and designs using the latest in technology are provided as part of this simple equation and forms the basis for a seamless strategic relationship.


In House Technical Capabilities

Screen Print & Fire - Laser Trim - Ceramic & Wafer Dicing - Hermetic Package Seal - Fine - Gross Leak - Temp Cycle - Constant Acceleration - Wirebond - Diebond - Tape & Reel -  Failure analysis  -  ATP Equipment  full in house capability.